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  • THICKNESS OF RADIO FREQUENCY ION-PLATING LAYERS
    An aluminium layer is approximately 2 microns thick. A combination layer of copper and nickle is approximately 1 micron thick. Compared with the thickness of a decoration use aluminium layer (0.03 to 0.07 microns) formed by a conventional vacuum deposition, extremely thicker shielding layers have been realized.
  • OPERATION OF SHIELDING
    In radio frequency bands, our radio frequency ion-plating layers show high shielding effects.
  • ADHESION
    Our radio frequency ion-plating layers passed an adhesive tape test according to Underwriters Laboratories standard in the United States at class 5B which means 0% of depletion.
  • ENVIRONMENTALLY FRIENDLY PROCESS
    Our radio frequency ion-plating method is a dry process to generate no material which pollutes the environment.
Radio-frequency ion-plating aluminium layer
Al

Radio-frequency ion-plating layer of copper and nikle
Cu+Ni


 Radio-frequency ion-plating layer of copper and IS-alloy
(INGS-developed alloy)
Cu+lS



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